INtelligent, Fast, Interconnected and Efficient devices for Frontier Exploitation in Research and Industry


Work Packages


Please find here below the report on the WP2 workpackage, with the introduction first here below and then attached in a .pdf format the rest of the report. This corresponds to the Report INFIERI is writing for each Period of the project. The first 18 months have been gathered in our report and there will be another one reporting on the 3rd year followed by the one corresponding to the 4th year of the project. This report has been approved by the INFIERI Publication Board and is edited by: 

Editors: Francis Calmon (INL-CNRS & INSA), Robert Patti (Tezzaron SA), Aurore Savoy-Navarro (University Paris-Diderot/CNRS & INFN-Pisa), on the basis of the material provided by CNRS, FNAL, Purdue University and TEZZARON SA.

WP2 – New Interconnect Technologies, Period 1

This is a technology-dedicated workpackage that has applications in WP1, WP3 and WP4. It is also linked to WP5 for the related 3D technology tools.

Coordinators: R. Patti (Tezzaron), A. Savoy-Navarro (CNRS-APC) and F. Calmon (CNRS-INL)

Contributors: R. Patti (Tezzaron), A. Savoy-Navarro (CNRS-APC), F. Calmon, R. Cellier, I. O’Connor, P. Pittet, L. Quiquerez, M. Vignetti (CNRS-INL), N. D’Ascenzo and V. Saveliev members of the Institute of Applied Mathematics in Russia, associated to CNRS, R. Lipton and T.H. Liu (FNAL)

INFIERI has gathered a valuable expertise both in the development as well as the use and applications of the most advanced 3D Vertical Interconnect technology. The partners mainly working on this WP are: CNRS (including two research Labs: APC and Nanotechnology Institut, in Lyon as well as three Top Engineering Schools (Technical Universities): Ecole Centrale, INSA and Ecole de Physique et Chimie in Lyon), Tezzaron Semiconductor leading firm in the field and FNAL in the USA. The main goal is to contribute to the further development on the most advanced aspects of this technology by applying it to challenging goals. These applications include its use for designing Front-End Electronics of detecting devices based on advanced pixel technology (WP1) (see Ron Lipton’s at FNAL and the VIPIC[1] project and the new INFIERI demonstrator developments), for designing 3D based architecture of High Performance Data Processing system as in the VIPRAM[2] project led by FNAL and Tezzaron (also part of WP4) and possible use related to the high flux data transmission systems especially Silicon Photonics related developments (WP3).

Matteo Vignetti (ESR2) has been appointed by CNRS and will concentrate on developing the WP2-INFIERI demonstrator (see subsection 2.3 on the WP2-INFIERI demonstrator). It was decided at the Kickoff meeting to build a dedicated WP2 INFIERI demonstrator that would serve to experience and further develop some of the most challenging features of this technology and at the same time have benefitial outcomes. Thus the goals are indeed even more ambitious than in the original proposal.

The WP2 strength is linked to the very important and continuous contribution of R. Patti from Tezzaron (several plenary talks during workshops and summer schools in Oxford and Paris, also dedicated labs on 3D IC design) associated with academics from CNRS (talk on 3D design tools focusing on electrical signal integrity at the workshop in Madrid, three computer labs on: CMOS photodiode and multi-buried junction photodetectors and SD modulator at the summer school in Oxford, Introduction to analog integrated circuit design - from schematic to layout at the summer school in Paris). Additionally, we have to emphasis the important contribution of CEA-LETI with two talks on 3D integration by G. Pares (workshop in Madrid) and Y. Lamy (summer school in Paris), and a talk on FDSOI technology by C. Fenouillet-Beranger (summer school in Paris). These contributions of LETI are bringing complementary inputs to the overall WP2 INFIERI project.



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Partners & Coordinators